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TSMC revealing details about next gen A14 node

Technology
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Regular Submission

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Technical Session

Abstract

A14 NanoFlexTM Pro platform technology features the world’s smallest SRAM with a cell size <0.017μm2 and highest SRAM macro density to date through dimensional ground rule scaling. Coupled with standard cell innovations, it delivers a full-node PPA improvement over the predecessor N2 technology for a 10~15% speed enhancement, a 25~30% power reduction and a chip density increase by ~20% driven by logic and SRAM scaling. Key features, such as TSV, innovative RDL that enables SoIC bond pitch of 4.5μm and high-performance MiM processes, have also been developed to accelerate the system-level integration and scaling for SoIC products. Supported by robust yield and device progress, A14 technology is on track for volume production in 2028.

Source: Hacker News

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